Examination of optimum test conditions for a 3-point bending and cutting test to evaluate sound emission of wafer during deformation

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dc.authorscopusid57197835538
dc.authorscopusid12789949500
dc.contributor.authorCarsanba, Erdem
dc.contributor.authorSchleining, Gerhard
dc.date.accessioned2024-09-19T15:41:23Z
dc.date.available2024-09-19T15:41:23Z
dc.date.issued2018
dc.departmentHatay Mustafa Kemal Üniversitesien_US
dc.description.abstractThe purpose of this study was to investigate optimum test conditions of acoustical-mechanical mea- surement of wafer analysed by Acoustic Envelope Detector attached to the Texture Analyser. Force- displacement and acoustic signals were simultaneously recorded applying two different methods (3-point bending and cutting test). In order to study acoustical-mechanical behaviour of wafers, the parameters \maximum sound pres- sure", 'total count peaks" and 'mean sound value" were used and optimal test conditions of microphone position and test speed were examined. With a microphone position of 45° angle and 1 cm distance and at a low test speed of 0.5 mm/s wafers of different quality could be distinguished best. The angle of microphone did not have significant effect on acoustic results and the number of peaks of the force and acoustic signal decreased with increasing distance and test speed. © 2018 ISEKI-Food Association (IFA).en_US
dc.identifier.doi10.7455/ijfs/7.1.2018.a2
dc.identifier.endpage23en_US
dc.identifier.issn2182-1054
dc.identifier.issue1en_US
dc.identifier.scopus2-s2.0-85045697997en_US
dc.identifier.scopusqualityQ3en_US
dc.identifier.startpage13en_US
dc.identifier.urihttps://doi.org/10.7455/ijfs/7.1.2018.a2
dc.identifier.urihttps://hdl.handle.net/20.500.12483/14234
dc.identifier.volume7en_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherISEKI Food Associationen_US
dc.relation.ispartofInternational Journal of Food Studiesen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.subjectAcousticen_US
dc.subjectCrispnessen_US
dc.subjectTextureen_US
dc.subjectWaferen_US
dc.titleExamination of optimum test conditions for a 3-point bending and cutting test to evaluate sound emission of wafer during deformationen_US
dc.typeArticleen_US

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