Electrodeposition and properties of Zn, Cu, and Cu1-x Znx thin films

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dc.authoridOZDEMIR, RASIM/0000-0003-1439-0444
dc.contributor.authorOzdemir, Rasim
dc.contributor.authorKarahan, Ismail Hakki
dc.date.accessioned2024-09-18T20:16:45Z
dc.date.available2024-09-18T20:16:45Z
dc.date.issued2014
dc.departmentHatay Mustafa Kemal Üniversitesien_US
dc.description9th Nanoscience and Nanotechnology Conference (NANOTR) -- JUN 24-28, 2013 -- Erzurum, TURKEYen_US
dc.description.abstractThe electrodeposition of Cu, Zn and Cu-Zn deposits from the non-cyanide Zn sulphate and Cu sulphate reduced by citrate at constant stirring speed has been investigated. The composition of the Cu-Zn bath was shown to influence the morphology, electrical resistivity, phase composition, and Cu and Zn content of the Cu-Zn deposits. Their structural and electrical properties have been investigated by X-ray diffraction (XRD), scanning electron microscope (SEM), energy dispersive X-ray spectroscopy (EDAX), cyclic voltammeter (CV) and current-voltage measurements against the temperature for electrical resistivity, respectively. XRD shows that Cu-Zn samples are polycrystalline phase. Resistivity results show that the copper film exhibits bigger residual resistivity than both the zinc and the Cu-Zn alloy. Theoretical calculations of the XRD peaks demonstrate that the average crystallite size of the Cu-Zn alloy decreased and microstrain increased when the Cu alloyed with zinc. (C) 2014 Elsevier B.V. All rights reserved.en_US
dc.description.sponsorshipMustafa Kemal University Scientific Research Projects [MKU-BAP-1204 D 0110]en_US
dc.description.sponsorshipFinancial support of this research by the Mustafa Kemal University Scientific Research Projects is gratefully acknowledged (MKU-BAP-1204 D 0110).en_US
dc.identifier.doi10.1016/j.apsusc.2014.06.188
dc.identifier.endpage318en_US
dc.identifier.issn0169-4332
dc.identifier.issn1873-5584
dc.identifier.scopus2-s2.0-84908368066en_US
dc.identifier.scopusqualityQ1en_US
dc.identifier.startpage314en_US
dc.identifier.urihttps://doi.org/10.1016/j.apsusc.2014.06.188
dc.identifier.urihttps://hdl.handle.net/20.500.12483/9728
dc.identifier.volume318en_US
dc.identifier.wosWOS:000344380500055en_US
dc.identifier.wosqualityQ1en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherElsevier Science Bven_US
dc.relation.ispartofApplied Surface Scienceen_US
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectElectrodepositionen_US
dc.subjectCu-Zn alloyen_US
dc.subjectElectrical propertyen_US
dc.subjectShape memory alloysen_US
dc.titleElectrodeposition and properties of Zn, Cu, and Cu1-x Znx thin filmsen_US
dc.typeConference Objecten_US

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