Amplifying main physical characteristics of CuO films using ascorbic acid as the reducer and stabilizer agent

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dc.authoridKahveci, Osman/0000-0001-5053-0577
dc.authoridSahin, Bunyamin/0000-0001-7059-0315
dc.authoridAydin, Rasit/0000-0001-5070-9649
dc.contributor.authorAkkaya, Abdullah
dc.contributor.authorKahveci, Osman
dc.contributor.authorAydin, Rasit
dc.contributor.authorSahin, Bunyamin
dc.date.accessioned2024-09-18T20:13:38Z
dc.date.available2024-09-18T20:13:38Z
dc.date.issued2021
dc.departmentHatay Mustafa Kemal Üniversitesien_US
dc.description.abstractCopper oxide thin films have been grown by successive ionic layer adsorption and reaction technique, which is inexpensive, environmentally friendly and simple onto soda-lime glass substrates from an aqueous copper (II) chloride dehydrate solution with and without the addition of ascorbic acid (AA) at 70 degrees C. Surface morphology, crystalline structure, chemical compositions, optical and electrical properties of thin films were investigated with a focus on the influences of different concentrations of AA. The analysis exhibited that the main physical performances of the CuO films were found to change with AA content. Estimated crystallite sizes decreased from 24.64 to 12.78 nm with the addition of AA in the growth bath solutions. The optical bandgap energy of CuO is found to increase from 1.42 to 1.55 eV as a consequence of the increasing AA content. As the AA concentration in the solution bath increases the transmittance increases from approximate to 5 to approximate to 28%. FTIR transmittance spectra of CuO have a characteristic stretching vibration mode of the metal-oxide bonds and the addition of AA caused the appearance of many peaks of this molecule. Contact resistance values decreased with the AA content from 0.657 x 10(9) to 0.342 x 10(9) omega. It is worth noting that the deposition technique is low cost and very simple; obtained CuO thin films could be appropriate for different technological applications.en_US
dc.identifier.doi10.1007/s00339-021-05078-4
dc.identifier.issn0947-8396
dc.identifier.issn1432-0630
dc.identifier.issue12en_US
dc.identifier.scopus2-s2.0-85119329416en_US
dc.identifier.scopusqualityQ2en_US
dc.identifier.urihttps://doi.org/10.1007/s00339-021-05078-4
dc.identifier.urihttps://hdl.handle.net/20.500.12483/9302
dc.identifier.volume127en_US
dc.identifier.wosWOS:000718093300002en_US
dc.identifier.wosqualityQ2en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherSpringer Heidelbergen_US
dc.relation.ispartofApplied Physics A-Materials Science & Processingen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectCuO filmen_US
dc.subjectAscorbic aciden_US
dc.subjectBandgapen_US
dc.subjectXRDen_US
dc.subjectFT-IRen_US
dc.subjectElectrical conductivityen_US
dc.titleAmplifying main physical characteristics of CuO films using ascorbic acid as the reducer and stabilizer agenten_US
dc.typeArticleen_US

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