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    Assessment of acoustic-mechanical measurements for crispness of wafer products
    (Elsevier Sci Ltd, 2018) Carsanba, Erdem; Duerrschmid, Klaus; Schleining, Gerhard
    The objective of this work was to investigate instrumental tests regarding the capacity to differentiate crispy wafer products of different quality and regarding to correlations between instrumental parameters and sensory descriptors. Therefore two fracturing methods, a 3-point bending and a cutting test with simultaneously recorded sound emissions and a descriptive sensory analysis were carried out with nine different brands of wafers representing different qualities. The results showed that both instrumental methods are capable to differentiate products of different quality, but in different ways. Only the maximum sound pressure (r = 0.89) and the number of force peaks (r = 0.83) of both tests correlate. The sensory descriptor crispness was mainly correlated with the area under sound-displacement curve (r = 0.76) and mean sound value (r = 0.59) of the cutting test, and weakly related to the number of force peaks (r = 0.42), the maximum sound pressure (r = 0.50) and the area under sound-displacement curve (r = 0.42) of the 3-point bending test. (C) 2017 Elsevier Ltd. All rights reserved.
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    Examination of optimum test conditions for a 3-point bending and cutting test to evaluate sound emission of wafer during deformation
    (ISEKI Food Association, 2018) Carsanba, Erdem; Schleining, Gerhard
    The purpose of this study was to investigate optimum test conditions of acoustical-mechanical mea- surement of wafer analysed by Acoustic Envelope Detector attached to the Texture Analyser. Force- displacement and acoustic signals were simultaneously recorded applying two different methods (3-point bending and cutting test). In order to study acoustical-mechanical behaviour of wafers, the parameters \maximum sound pres- sure", 'total count peaks" and 'mean sound value" were used and optimal test conditions of microphone position and test speed were examined. With a microphone position of 45° angle and 1 cm distance and at a low test speed of 0.5 mm/s wafers of different quality could be distinguished best. The angle of microphone did not have significant effect on acoustic results and the number of peaks of the force and acoustic signal decreased with increasing distance and test speed. © 2018 ISEKI-Food Association (IFA).