Assessment of acoustic-mechanical measurements for crispness of wafer products
Yükleniyor...
Dosyalar
Tarih
2018
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Elsevier Sci Ltd
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
The objective of this work was to investigate instrumental tests regarding the capacity to differentiate crispy wafer products of different quality and regarding to correlations between instrumental parameters and sensory descriptors. Therefore two fracturing methods, a 3-point bending and a cutting test with simultaneously recorded sound emissions and a descriptive sensory analysis were carried out with nine different brands of wafers representing different qualities. The results showed that both instrumental methods are capable to differentiate products of different quality, but in different ways. Only the maximum sound pressure (r = 0.89) and the number of force peaks (r = 0.83) of both tests correlate. The sensory descriptor crispness was mainly correlated with the area under sound-displacement curve (r = 0.76) and mean sound value (r = 0.59) of the cutting test, and weakly related to the number of force peaks (r = 0.42), the maximum sound pressure (r = 0.50) and the area under sound-displacement curve (r = 0.42) of the 3-point bending test. (C) 2017 Elsevier Ltd. All rights reserved.
Açıklama
2nd Congress on Food Structure Design (FSD) -- 2016 -- Antalya, TURKEY
Anahtar Kelimeler
Acoustic, Crispness, Texture, Wafer
Kaynak
Journal of Food Engineering
WoS Q Değeri
Q1
Scopus Q Değeri
Q1
Cilt
229
