Assessment of acoustic-mechanical measurements for crispness of wafer products

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dc.authoridDuerrschmid, Klaus/0000-0002-4564-2846
dc.authoridCARSANBA, ERDEM/0000-0002-7218-5070
dc.contributor.authorCarsanba, Erdem
dc.contributor.authorDuerrschmid, Klaus
dc.contributor.authorSchleining, Gerhard
dc.date.accessioned2024-09-18T19:50:18Z
dc.date.available2024-09-18T19:50:18Z
dc.date.issued2018
dc.departmentHatay Mustafa Kemal Üniversitesien_US
dc.description2nd Congress on Food Structure Design (FSD) -- 2016 -- Antalya, TURKEYen_US
dc.description.abstractThe objective of this work was to investigate instrumental tests regarding the capacity to differentiate crispy wafer products of different quality and regarding to correlations between instrumental parameters and sensory descriptors. Therefore two fracturing methods, a 3-point bending and a cutting test with simultaneously recorded sound emissions and a descriptive sensory analysis were carried out with nine different brands of wafers representing different qualities. The results showed that both instrumental methods are capable to differentiate products of different quality, but in different ways. Only the maximum sound pressure (r = 0.89) and the number of force peaks (r = 0.83) of both tests correlate. The sensory descriptor crispness was mainly correlated with the area under sound-displacement curve (r = 0.76) and mean sound value (r = 0.59) of the cutting test, and weakly related to the number of force peaks (r = 0.42), the maximum sound pressure (r = 0.50) and the area under sound-displacement curve (r = 0.42) of the 3-point bending test. (C) 2017 Elsevier Ltd. All rights reserved.en_US
dc.identifier.doi10.1016/j.jfoodeng.2017.11.006
dc.identifier.endpage101en_US
dc.identifier.issn0260-8774
dc.identifier.issn1873-5770
dc.identifier.scopus2-s2.0-85035118191en_US
dc.identifier.scopusqualityQ1en_US
dc.identifier.startpage93en_US
dc.identifier.urihttps://doi.org/10.1016/j.jfoodeng.2017.11.006
dc.identifier.urihttps://hdl.handle.net/20.500.12483/7337
dc.identifier.volume229en_US
dc.identifier.wosWOS:000428825100013en_US
dc.identifier.wosqualityQ1en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherElsevier Sci Ltden_US
dc.relation.ispartofJournal of Food Engineeringen_US
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectAcousticen_US
dc.subjectCrispnessen_US
dc.subjectTextureen_US
dc.subjectWaferen_US
dc.titleAssessment of acoustic-mechanical measurements for crispness of wafer productsen_US
dc.typeConference Objecten_US

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